Temperature compensation in memory sensing

ABSTRACT

Apparatus and methods to vary, in response to temperature, a precharge voltage level of a sense node during a sense operation, a sense node develop time during the sense operation, and/or a ratio of a deboost voltage level capacitively decoupled from the sense node to a boost voltage level capacitively coupled to the sense node during the sense operation.

RELATED APPLICATION

This Application is a Continuation of U.S. application Ser. No.15/248,692, titled “TEMPERATURE COMPENSATION IN MEMORY SENSING,” filedAug. 26, 2016, (allowed) which is commonly assigned and incorporatedherein by reference.

TECHNICAL FIELD

The present disclosure relates generally to apparatus containing memorycells and methods of their operation, and, in particular, in one or moreembodiments, the present disclosure relates to temperature compensationin memory sensing.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuit devices in computers or other electronic devices.There are many different types of memory including random-access memory(RAM), read only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Changes in threshold voltage of the memory cells, through programming(which is often referred to as writing) of charge storage structures(e.g., floating gates or charge traps) or other physical phenomena(e.g., phase change or polarization), determine the data state (e.g.,data value) of each memory cell. Common uses for flash memory includepersonal computers, personal digital assistants (PDAs), digital cameras,digital media players, cellular telephones, solid state drives andremovable memory modules, and the uses are growing.

Sensing (e.g., reading or verifying) a data state of a memory cell ofteninvolves detecting whether the memory cell is activated in response to aparticular voltage applied to its control gate, such as by detectingwhether a data line connected to the memory cell experiences a change involtage level caused by current flow through the memory cell. Circuitryused to detect such changes in voltage level are often affected bytemperature variations. This can lead to an inaccurate determination ofthe data state of a sensed memory cell.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative methods of operating memory, and apparatus to perform suchmethods.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory in communication with aprocessor as part of an electronic system, according to an embodiment.

FIG. 2 is a schematic of a portion of an array of memory cells as couldbe used in a memory of the type described with reference to FIG. 1.

FIG. 3 is a schematic of a sense circuit for use with variousembodiments

FIGS. 4A-4C are timing diagrams generally depicting a voltage level of asense node of a sense circuit such as depicted in FIG. 3 at variousstages of a sense operation in accordance with embodiments.

FIGS. 5A-5C are timing diagrams generally depicting a voltage level ofvarious nodes of a sense circuit such as depicted in FIG. 3 at variousstages of a sense operation in accordance with embodiments.

FIGS. 6A and 6B are schematics of portions of a sense circuit inaccordance with embodiments.

FIG. 7 is a flowchart of a portion of a method of operating a memoryaccording to an embodiment.

FIG. 8 depicts various decreasing functions for use with embodiments.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likereference numerals describe substantially similar components throughoutthe several views. Other embodiments may be utilized and structural,logical and electrical changes may be made without departing from thescope of the present disclosure. The following detailed description is,therefore, not to be taken in a limiting sense.

Sense operations (e.g., read or verify operations) may be utilized todetermine a data state of a memory cell, which may be output from amemory (e.g., memory device) responsive to a read operation, or used todetermine whether the memory cell has reached a desired data stateduring a program operation. Changes in temperature of the memory devicecan affect the operation of sense circuits used to determine the datastate, which can lead to erroneous indications of the data state of thememory cell. Various embodiments facilitate compensation for temperature(e.g., temperature variations) by varying timing and/or voltage levelsused during operation of a sense circuit and/or through alteration ofthe structure of the sense circuit itself.

FIG. 1 is a simplified block diagram of a first apparatus, in the formof a memory (e.g., memory device) 100, in communication with a secondapparatus, in the form of a processor 130, as part of a third apparatus,in the form of an electronic system, according to an embodiment. Someexamples of electronic systems include personal computers, personaldigital assistants (PDAs), digital cameras, digital media players,digital recorders, games, appliances, vehicles, wireless devices,cellular telephones and the like. The processor 130, e.g., a controllerexternal to the memory device 100, may be a memory controller or otherexternal host device.

Memory device 100 includes an array of memory cells 104 logicallyarranged in rows and columns. Memory cells of a logical row aretypically connected to the same access line (commonly referred to as aword line) while memory cells of a logical column are typicallyselectively connected to the same data line (commonly referred to as abit line). A single access line may be associated with more than onelogical row of memory cells and a single data line may be associatedwith more than one logical column. Memory cells (not shown in FIG. 1) ofat least a portion of array of memory cells 104 are capable of beingprogrammed to one of at least two data states.

A row decode circuitry 108 and a column decode circuitry 110 areprovided to decode address signals. Address signals are received anddecoded to access the array of memory cells 104. Memory device 100 alsoincludes input/output (I/O) control circuitry 112 to manage input ofcommands, addresses and data to the memory device 100 as well as outputof data and status information from the memory device 100. An addressregister 114 is in communication with I/O control circuitry 112 and rowdecode circuitry 108 and column decode circuitry 110 to latch theaddress signals prior to decoding. A command register 124 is incommunication with I/O control circuitry 112 and control logic 116 tolatch incoming commands.

A controller (e.g., control logic 116 internal to the memory device 100)controls access to the array of memory cells 104 in response to thecommands and generates status information for the external processor130, i.e., control logic 116 is configured to perform access operationsin accordance with embodiments described herein. The control logic 116is in communication with row decode circuitry 108 and column decodecircuitry 110 to control the row decode circuitry 108 and column decodecircuitry 110 in response to the addresses. The control logic 116 isfurther in communication with temperature sensor 126. Temperature sensor126 may sense a temperature of the memory device 100 and provide anindication to the control logic 116 representative of that temperature,such as some voltage or resistance level. Some examples of a temperaturesensor 126 might include a thermocouple, a resistive device, athermistor or an infrared sensor. Alternatively, temperature sensor 126may be external to memory device 100 and in communication with theexternal processor 130. In this configuration, temperature sensor 126may provide an indication of ambient temperature rather than devicetemperature. Processor 130 could communicate the indicationrepresentative of the temperature to the control logic 116, such asacross input/output (I/O) bus 134 as a digital representation.

Control logic 116 is also in communication with a cache register 118.Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the arrayof memory cells 104 is busy writing or reading, respectively, otherdata. During a program operation (e.g., write operation), data is passedfrom the cache register 118 to data register 120 for transfer to thearray of memory cells 104; then new data is latched in the cacheregister 118 from the I/O control circuitry 112. During a readoperation, data is passed from the cache register 118 to the I/O controlcircuitry 112 for output to the external processor 130; then new data ispassed from the data register 120 to the cache register 118. A statusregister 122 is in communication with I/O control circuitry 112 andcontrol logic 116 to latch the status information for output to theprocessor 130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals may includeat least a chip enable CE#, a command latch enable CLE, an address latchenable ALE, and a write enable WE#. Additional control signals (notshown) may be further received over control link 132 depending upon thenature of the memory device 100. Memory device 100 receives commandsignals (which represent commands), address signals (which representaddresses), and data signals (which represent data) from processor 130over a multiplexed input/output (I/O) bus 134 and outputs data toprocessor 130 over I/O bus 134.

For example, the commands are received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and are written intocommand register 124. The addresses are received over input/output (I/O)pins [7:0] of I/O bus 134 at I/O control circuitry 112 and are writteninto address register 114. The data are received over input/output (I/O)pins [7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a16-bit device at I/O control circuitry 112 and are written into cacheregister 118. The data are subsequently written into data register 120for programming the array of memory cells 104. For another embodiment,cache register 118 may be omitted, and the data are written directlyinto data register 120. Data are also output over input/output (I/O)pins [7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a16-bit device.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the memory device 100 ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 may not necessarily be segregated to distinct components orcomponent portions of an integrated circuit device. For example, asingle component or component portion of an integrated circuit devicecould be adapted to perform the functionality of more than one blockcomponent of FIG. 1. Alternatively, one or more components or componentportions of an integrated circuit device could be combined to performthe functionality of a single block component of FIG. 1.

Additionally, while specific I/O pins are described in accordance withpopular conventions for receipt and output of the various signals, it isnoted that other combinations or numbers of I/O pins may be used in thevarious embodiments.

FIG. 2 is a schematic of a NAND memory array 200, e.g., as a portion ofarray of memory cells 104. Memory array 200 includes access lines, suchas word lines 2020 to 202N, and data lines, such as bit lines 204 ₀ to204 _(M). The word lines 202 may be connected to global access lines(e.g., global word lines), not shown in FIG. 2, in a many-to-onerelationship. For some embodiments, memory array 200 may be formed overa semiconductor that, for example, may be conductively doped to have aconductivity type, such as a p-type conductivity, e.g., to form ap-well, or an n-type conductivity, e.g., to form an n-well.

Memory array 200 might be arranged in rows (each corresponding to a wordline 202) and columns (each corresponding to a bit line 204). Eachcolumn may include a string of series-connected memory cells, such asone of NAND strings 206 ₀ to 206 _(M). Each NAND string 206 might beconnected (e.g., selectively connected) to a common source 216 and mightinclude memory cells 208 ₀ to 208 _(N). The memory cells 208 representnon-volatile memory cells for storage of data. The memory cells 208 ofeach NAND string 206 might be connected in series between a selecttransistor 210 (e.g., a field-effect transistor), such as one of theselect transistors 210 ₀ to 210 _(M) (e.g., that may be source selecttransistors, commonly referred to as select gate source), and a selecttransistor 212 (e.g., a field-effect transistor), such as one of theselect transistors 212 ₀ to 212 _(M) (e.g., that may be drain selecttransistors, commonly referred to as select gate drain). Selecttransistors 210 ₀ to 210 _(M) might be commonly connected to a selectline 214, such as a source select line, and select transistors 212 ₀ to212 _(M) might be commonly connected to a select line 215, such as adrain select line.

A source of each select transistor 210 might be connected to commonsource 216. The drain of each select transistor 210 might be connectedto a memory cell 208 ₀ of the corresponding NAND string 206. Forexample, the drain of select transistor 210 ₀ might be connected tomemory cell 208 ₀ of the corresponding NAND string 206 ₀. Therefore,each select transistor 210 might be configured to selectively couple acorresponding NAND string 206 to common source 216. A control gate ofeach select transistor 210 might be connected to select line 214.

The drain of each select transistor 212 might be connected to the bitline 204 for the corresponding NAND string 206. For example, the drainof select transistor 212 ₀ might be connected to the bit line 204 ₀ forthe corresponding NAND string 206 o. The source of each selecttransistor 212 might be connected to a memory cell 208 _(N) of thecorresponding NAND string 206. For example, the source of selecttransistor 212 ₀ might be connected to memory cell 208 _(N) of thecorresponding NAND string 206 o. Therefore, each select transistor 212might be configured to selectively connect a corresponding NAND string206 to a corresponding bit line 204. A control gate of each selecttransistor 212 might be connected to select line 215.

The memory array in FIG. 2 might be a quasi-two-dimensional memory arrayand might have a generally planar structure, e.g., where the commonsource 216, NAND strings 206 and bit lines 204 extend in substantiallyparallel planes. Alternatively, the memory array in FIG. 2 might be athree-dimensional memory array, e.g., where NAND strings 206 may extendsubstantially perpendicular to a plane containing the common source 216and to a plane containing the bit lines 204 that may be substantiallyparallel to the plane containing the common source 216.

Typical construction of memory cells 208 includes a data-storagestructure 234 (e.g., a floating gate, charge trap, etc.) that candetermine a data state of the cell (e.g., through changes in thresholdvoltage), and a control gate 236, as shown in FIG. 2. In some cases,memory cells 208 may further have a defined source 230 and a defineddrain 232. Memory cells 208 have their control gates 236 connected to(and in some cases form) a word line 202.

A column of the memory cells 208 is a NAND string 206 or a plurality ofNAND strings 206 selectively connected to a given bit line 204. A row ofthe memory cells 208 are memory cells 208 commonly connected to a givenword line 202. A row of memory cells 208 can, but need not include allmemory cells 208 commonly connected to a given word line 202. Rows ofmemory cells 208 may often be divided into one or more groups ofphysical pages of memory cells 208, and physical pages of memory cells208 often include every other memory cell 208 commonly connected to agiven word line 202. For example, memory cells 208 commonly connected toword line 202N and selectively connected to even bit lines 204 (e.g.,bit lines 204 ₀, 204 ₂, 204 ₄, etc.) may be one physical page of memorycells 208 (e.g., even memory cells) while memory cells 208 commonlyconnected to word line 202N and selectively connected to odd bit lines204 (e.g., bit lines 204 ₁, 204 ₃, 204 ₅, etc.) may be another physicalpage of memory cells 208 (e.g., odd memory cells). Although bit lines204 ₃-204 ₅ are not expressly depicted in FIG. 2, it is apparent fromthe figure that the bit lines 204 of the array of memory cells 200 maybe numbered consecutively from bit line 204 ₀ to bit line 204 _(M).Other groupings of memory cells 208 commonly connected to a given wordline 202 may also define a physical page of memory cells 208. Forcertain memory devices, all memory cells commonly connected to a givenword line might be deemed a physical page. The portion of a physicalpage (which, in some embodiments, could still be the entire row) that isread during a single read operation or programmed during a programoperation (e.g., an upper or lower page memory cells) might be deemed alogical page.

In sensing (e.g., reading) a data state of a selected (e.g., target)memory cell, the memory cell is selectively activated in response to aparticular voltage level applied to its control gate while current pathsfrom the memory cell to the data line and to the source are established,thus permitting current flow, or lack thereof, between the data line andthe source to indicate whether the memory cell has been activated inresponse to the particular voltage level applied to its control gate.For example, for a sensing operation of selected memory cell 208 _(x+1)of NAND string 206 ₀, a sense voltage (e.g., a read voltage or a verifyvoltage) could be applied to the control gate of memory cell 208 _(x+1)while voltage levels are applied to the control gates of memory cells208 ₀ to 208 _(x) and 208 _(x+2) to 208 _(N) of NAND string 206 ₀sufficient to activate those memory cells regardless of their datastates, and while voltage levels are applied to the control gates ofselect transistors 210 ₀ and 212 ₀ sufficient to activate thosetransistors. Whether the memory cell 208 _(x+1) is activated in responseto the sense voltage may indicate one or more digits of the data statestored in that memory cell.

Although the example of FIG. 2 is discussed in conjunction with NANDflash, the embodiments and concepts described herein are not limited toa particular array architecture or structure, and can include otherstructures (e.g., cross-point memory, DRAM, etc.) and otherarchitectures (e.g., AND arrays, NOR arrays, etc.).

Sense circuits are typically utilized in memory devices to facilitateperforming a sense (e.g., read and/or verify) operation on each of oneor more selected (e.g., target) memory cells in the memory device. FIG.3 illustrates a sense circuit 300 for use with various embodiments.Sense circuit 300 is shown connected to a particular NAND string 206 bya particular data line 204, such as shown in more detail in FIG. 2, forexample. Note that select transistors 210 and 212 selectively connectingthe NAND string 206 to the source 216 and data line 204, respectively,are not shown in FIG. 3. While the discussion is directed to use of thesense circuit 300 with a NAND string 206, other memory structures andarchitectures are suitable for use with sense circuit 300 where acurrent path can be selectively created from the data line 204 to thesource 216 dependent upon a data state of a memory cell selected forsensing.

As part of a sense operation, e.g., a precharge portion, the sensecircuit 300 may precharge a sense node (e.g., tc node) 340 by activatinga precharge transistor (e.g., n-type field effect transistor, or nFET)344 by biasing (e.g., driving) the signal line 342 to a particularvoltage level (e.g., a voltage level of control signal blpre) sufficientto activate the transistor 344. Control signals of the sense circuit 300may be provided by the internal controller (e.g., control logic 116) ofthe memory device 100. Such control signals (e.g., both voltage levelsand timing) are defined by the sense operation and are distinguishedfrom signals generated in response to performing the sense operation(e.g., the output signal sa_out or a voltage level generated on thesense node 340).

Transistor 344 is connected between a voltage node 346 and the sensenode 340. Voltage node 346 might be configured to receive a supplyvoltage, e.g., Vcc. For some embodiments, voltage node 346 may be avariable voltage node. The capacitance 348 shown coupled to the sensenode 340 may be representative of the capacitance at the sense node 340and additional circuitry connected to it, e.g., transistors 344, 350 and352. Voltage node 354 (e.g., a variable voltage node) is configured toapply a voltage level to the capacitance 348 which may induce a changein voltage level on the sense node 340, for example, to boost the sensenode 340 to a higher voltage level, such as through capacitive coupling.

Additional transistors of the sense circuit facilitate sensing of avoltage level on the sense node 340. For example, the control gate of asense transistor (e.g., p-type field effect transistor, or pFET) 350 isshown connected to the sense node 340. Thus, transistor 350 isconfigured to be responsive to a voltage level present on the sense node340. Signal line 356 connected to the gate of a sense enable transistor(e.g., pFET) 358 and configured to receive control signal senbfacilitates isolating the transistor 350 from the voltage node 360,which may be configured to receive a supply voltage, e.g., Vcc. Thesense circuit output (e.g., sa_out) line 362 might be connected toadditional circuitry (not shown in FIG. 3) of the memory deviceconfigured to respond to the sense circuit 300 as part of a sensingoperation. For example, the sense circuit 300 may be a component of thedata register 120 of FIG. 1 and its output sa_out may be provided as aninput to the cache register 118 for output of the sensed data state fromthe memory device 100. The output signal sa_out on output line 362 mightcomprise a signal generated by a latch (e.g., latch circuit) 364 whichis representative of a logic level, such as a logic ‘high’ (e.g.,represented by Vcc) or logic ‘low’ (e.g., represented by Vss) levelindicative of a sensed data state of a selected memory cell of NANDstring 206, for example. Latch 364 may comprise a pair of cross-coupledinverters, for example. For some embodiments, latch 364 might beeliminated, connecting the output line 362 to the transistor 350.

During a precharge portion of a sense operation, the gate of transistor344 is biased by a voltage level (e.g., of control signal blpre) onsignal line 342 to precharge the sense node 340 by injecting a prechargecurrent into the sense node 340. An additional voltage level (e.g., ofcontrol signal blclamp) may be applied to signal line 366 to activatetransistor (e.g., nFET) 368, and a further voltage level (e.g., ofcontrol signal tc_iso) may be applied to signal line 370 to activatetransistor (e.g., nFET) 352. Activating transistors 344, 352 and 368serves to connect data line 204 to the voltage node 346, therebyprecharging the sense node 340 and the data line 204.

Following the precharging of the sense node 340 and the data line 204, asecond portion of the sense operation is performed to detect whether ornot the precharged data line 204 and sense node 340 is discharged duringthe sense operation, thereby determining the data state of the memorycell selected for sensing. In general, following the precharging of thesense node 340 and the data line 204, the sense node 340 may be isolatedfrom the data line 204, such as by deactivating the transistor 368and/or deactivating the transistor 352. The data line 204 is thenselectively connected to the source 216 depending upon whether thememory cell selected for sensing is activated or deactivated in responseto a sense voltage applied to its control gate. After the data line 204is given an opportunity to discharge if current is flowing through theNAND string 206, the sense node 340 may again be connected to the dataline 204 by activating the transistors 352 and 368. If a voltage levelof the data line 204 is lower than the precharge voltage level due tocurrent flow through the NAND string 206, the voltage level of the sensenode 340 will likewise experience a drop. If the voltage level of thedata line 204 remains at the precharge voltage level, such as when thememory cell selected for sensing remains deactivated, the voltage levelof the sense node 340 may remain at its precharge (or boosted) voltagelevel. With the transistor 358 activated, and the voltage level of thesense node 340 applied to the control gate of the transistor 350, thevoltage node 360 may be selectively connected to the latch 364 dependingupon a voltage level of the sense node 340. The latch 364 may have aparticular logic level (e.g., logic high) prior to sensing. If thevoltage level of the voltage node 360 is applied to the input of thelatch 364 upon activation of the transistor 358, its logic level maychange, e.g., from a logic high level to a logic low level, and if thevoltage node 360 remains isolated from the input of the latch 364 uponactivation of the transistor 358, its logic level may remain at theparticular logic level.

Various embodiments may utilize boosting and deboosting of the sensenode 340 during the sense operation. Boosting (e.g., capacitivelycoupling a boost voltage level to) and deboosting (e.g., capacitivelydecoupling a deboost voltage level from) the sense node 340 might beused, for example, to facilitate a higher develop overhead. By boostingthe sense node 340 prior to the sense node develop time, the voltagelevel of the sense node 340 can be allowed to develop longer withoutprematurely indicating current flow of the data line 204. Subsequentdeboosting of the sense node 340 after isolation from the NAND string206 from the data line 204 permits the voltage level of the sense node340 to drop below the trip point (e.g., threshold voltage) of thetransistor 350 to indicate that current flow was detected.

The trip point of the sense circuit 300 may generally be dependent uponthe threshold voltage of the transistor 350. The sense circuit 300 istypically configured to have a trip point (e.g., sense threshold level)close to the precharge voltage level that may be established on thesense node 340 prior to sensing the selected memory cell. The trip pointmight be a particular voltage level on the sense node 340 wherein thesense circuit 300 outputs a first logic level indicative of a first datastate of a sensed selected memory cell when the voltage level of thesense node 340 is equal to or above the trip point. The sense circuit300 might output a second logic level indicative of a second data stateof the sensed selected memory cell when the voltage level of the sensenode 340 is below the trip point, for example.

FIGS. 4A-4C are timing diagrams generally depicting waveform 441representing a voltage level of a sense node 340 of a sense circuit 300such as depicted in FIG. 3 at various stages of different types of senseoperations. With regard to FIG. 4A, a precharge portion of the senseoperation may begin at time t0 by biasing control signals blpre, blclampand tc_iso to voltage levels sufficient to activate transistors 344, 368and 352, respectively, thereby connecting the sense node 340 to thevoltage node 346 and the data line 204. In response, the waveform 441increases. At time t1, the sense node 340 may be isolated from the dataline 204 and the voltage node 346 to end the precharge portion, such asby deactivation of the transistors 344 and 368. Between time t1 and timet2, the data line 204 is selectively connected to the source 216depending upon whether the memory cell selected for sensing is activatedor not in response to the sense voltage, and is allowed to discharge ifconnected. At time t2, the sense node 340 is again connected to the dataline 204 and, where the data line 204 has discharged, the waveform 441will decrease such as depicted in the example of FIG. 4A. The timeperiod between time t2 and t3 of FIG. 4A, i.e., when the sense node 340is allowed to seek to equilibrate with the data line 204 after it hasbeen connected to the memory cell selected for sensing, may be referredto as the sense node develop time. At time t4, the transistor 350 isconnected to the voltage node 360, thereby generating the output signalsa_out to have a logic level (e.g., voltage level) indicative of whetherthe waveform 441 has fallen below the trip point 443, and thusindicative of the data state of the memory cell being sensed.

FIG. 4B may utilize a similar sense operation as described withreference to FIG. 4A with the inclusion of boosting and deboosting ofthe voltage level of the sense node 340. In particular, with regard toFIG. 4B, a precharge portion of the sense operation may begin at time t0by biasing control signals blpre, blclamp and tc_iso to voltage levelssufficient to activate transistors 344, 368 and 352, respectively,thereby connecting the sense node 340 to the voltage node 346 and thedata line 204. In response, the waveform 441 increases. At time t1, thesense node 340 may be isolated from the data line 204 and the voltagenode 346 to end the precharge portion, such as by deactivation of thetransistors 344 and 368. At time t1a, the sense node 340 is boosted bysome particular voltage level above the precharge voltage level, such asby applying a boost voltage 551 (e.g., boost voltage level) to thevoltage node 354, reaching a boosted voltage level at time t1b. Betweentime t1 and time t2, the data line 204 is selectively connected to thesource 216 depending upon whether the memory cell selected for sensingis activated or not in response to the sense voltage, and is allowed todischarge if connected. At time t2, the sense node 340 is againconnected to the data line 204 and, where the data line 204 hasdischarged, the waveform 441 will decrease such as depicted in theexample of FIG. 4B. The time period between time t2 and t3 of FIG. 4B,i.e., when the sense node 340 is allowed to seek to equilibrate with thedata line 204 after it has been connected to the memory cell selectedfor sensing, may be referred to as the sense node develop time. At timet4, after the sense node 340 has been connected to, and subsequentlyisolated from, the data line 204, the sense node 340 is deboosted by theparticular voltage level, reaching a deboosted voltage level at timet4a. At time t5, the transistor 350 is connected to the voltage node360, thereby generating the output signal sa_out to have a logic level(e.g., voltage level) indicative of whether the waveform 441 has fallenbelow the trip point 443, and thus indicative of the data state of thememory cell being sensed.

FIG. 4C may utilize a similar sense operation as described withreference to FIG. 4B without isolation of the sense node 340 until afterthe sense node develop time, and without an isolated boosting, such asat time t1a of FIG. 4B. In particular, with regard to FIG. 4C, aprecharge portion of the sense operation may begin at time t0 by biasingcontrol signals blpre, blclamp and tc_iso to voltage levels sufficientto activate transistors 344, 368 and 352, respectively, therebyconnecting the sense node 340 to the voltage node 346 and the data line204. In response, the waveform 441 increases. A boost voltage of someparticular voltage level may be applied to the voltage node 354 duringthis time. At time t1, the sense node 340 may be isolated from thevoltage node 346 to end the precharge portion, such as by deactivationof the transistor 344. The data line 204 is selectively connected to thesource 216 depending upon whether the memory cell selected for sensingis activated or not in response to the sense voltage, and is allowed todischarge if connected. Where the data line 204 is discharging, thewaveform 441 will decrease such as depicted in the example of FIG. 4C.The time period between time t1 and t2 of FIG. 4C, i.e., when the sensenode 340 is allowed to seek to equilibrate with the data line 204 isconnected to the memory cell selected for sensing, may be referred to asthe sense node develop time. Note that the sense node develop time ofeach of the embodiments of FIGS. 4A-4C involves connection of the sensenode 340 to the data line 204, and isolation of the sense node 340 fromthe voltage node 346. At time t3, after the sense node 340 has beenisolated from the data line 204, the sense node 340 is deboosted by theparticular voltage level, reaching a deboosted voltage level at timet3a. At time t4, the transistor 350 is connected to the voltage node360, thereby generating the output signal sa_out to have a logic level(e.g., voltage level) indicative of whether the waveform 441 has fallenbelow the trip point 443, and thus indicative of the data state of thememory cell being sensed.

Trip point 443 of the transistor 350 might represent a trip point atsome nominal temperature, such as a desired operating temperature of thesense circuit 300. However, as temperatures vary from this nominaltemperature, the trip point (e.g., threshold voltage) of the transistor350 may change. For example, as depicted in FIG. 4A, at temperatureshigher than the nominal temperature, the trip point of the transistor350 may be represented as trip point 445 (e.g., some threshold voltagelevel higher than trip point 443), while at temperatures lower than thenominal temperature, the trip point of the transistor 350 may berepresented as trip point 447 (e.g., some threshold voltage level lowerthan trip point 443). In the example of FIG. 4A, it can be seen that ifthe trip point of the transistor 350 is represented by trip point 447,an erroneous indication of the data state of the memory cell wouldresult. Similarly, if the precharge voltage level is chosen to be closeto the nominal trip point 443, a rise of the trip point of thetransistor 350 to trip point 445 may result in an indication of currentflow where none has occurred when the precharge voltage level is lessthan trip point 445. These concepts also apply to the examples of FIGS.4B and 4C.

FIG. 5A is a timing diagram generally depicting a voltage level ofvarious nodes of a sense circuit such as depicted in FIG. 3 at variousstages of a sense operation, providing additional detail to a senseoperation such as described with reference to FIG. 4B. With regard toFIG. 5A, a precharge portion of the sense operation may begin at time t0by biasing control signals blpre, blclamp and tc_iso to voltage levelssufficient to activate transistors 344, 368 and 352, respectively,thereby connecting the data line 204 and the sense node 340 to thevoltage node 346. In response the voltage level tc of the sense node 340and the voltage level data line of the data line 204 increase. At timet1, the sense node 340 may be isolated from the data line 204 and thevoltage node 346, such as by biasing control signals blpre and blclampto voltage levels sufficient to deactivate the transistors 344 and 368.Note that the control signal tc_iso may remain at the level sufficientto activate the transistor 352 as transistor 368 provides isolation fromthe data line 204.

Between time t1 and time t2, the data line 204 is selectively connectedto the source 216 depending upon whether the memory cell selected forsensing is activated or not in response to the sense voltage. If thememory cell is activated, the data line 204 may decrease in voltage ascurrent flows through the NAND string 206, such as depicted in dashedline, and if the memory cell is deactivated, the data line 204 mayremain at the precharge voltage level, such as depicted in solid line.At time t1a, the boost voltage is applied at voltage node 354, therebyboosting the voltage level of the sense node 340 to a boosted voltagelevel (e.g., higher than the precharge voltage level) at time t1b. Attime t2, the sense node 340 is again connected to the data line 204,such as by biasing control signal blpre to a voltage level sufficient toactivate the transistor 368, and, where the data line 204 hasdischarged, the voltage level of the sense node 340 will decrease suchas depicted in dashed line tc. At time t3, the sense node 340 isisolated from the data line 204, such as by biasing control signalsblclamp and/or tc_iso to voltage levels sufficient to deactivate one orboth transistors 352 and 368. At time t4, after the sense node 340 hasbeen connected to, and subsequently isolated from, the data line 204,the sense node 340 is deboosted by some particular voltage level, suchas by removing a deboost voltage 553 (e.g., deboost voltage level) fromthe voltage node 354, thereby reaching a deboosted voltage level at timet4a. At time t5, the transistor 350 is connected to the voltage node 360by biasing the control signal senb to a voltage level sufficient toactivate the transistor 358. If the transistor 350 is activated, thevoltage node 360 is connected to the latch 364, thereby changing thelogic level of the output signal sa_out, and if the transistor 350 isdeactivated, the voltage node 360 remains isolated form the latch 364,allowing the logic level of the output signal sa_out to remainunchanged. While this example describes a change in logic level of theoutput signal sa_out (e.g., a change in the logic level of the latch364) from a logic high level to a logic low level as indicating thevoltage level of the sense node 340 being below the trip point of thetransistor 350, a transition from a logic low level to a logic highlevel could alternatively be provided with appropriate changes in thelatch 364, e.g., by providing an additional inverter to the output ofthe latch.

FIG. 5B is a timing diagram generally depicting a voltage level ofvarious nodes of a sense circuit such as depicted in FIG. 3 at variousstages of a sense operation, providing additional detail to a senseoperation such as described with reference to FIG. 4C. With regard toFIG. 5B, a precharge portion of the sense operation may begin at time t0by biasing control signals blpre, blclamp and tc_iso to voltage levelssufficient to activate transistors 344, 368 and 352, respectively,thereby connecting the data line 204 and the sense node 340 to thevoltage node 346. In response the voltage level tc of the sense node 340and the voltage level data line of the data line 204 increase. The boostvoltage 551 (e.g., boost voltage level) may be applied at voltage node354 during this time, reaching a level 551 at time t0a. At time t1, thesense node 340 may be isolated from the voltage node 346, such as bybiasing control signal blpre to a voltage level sufficient to deactivatethe transistor 344.

Between time t1 and time t2, the data line 204 is selectively connectedto the source 216 depending upon whether the memory cell selected forsensing is activated or not in response to the sense voltage. If thememory cell is activated, the data line 204 may decrease in voltage ascurrent flows through the NAND string 206, such as depicted in dashedline, and if the memory cell is deactivated, the data line 204 mayremain at the precharge voltage level, such as depicted in solid line.In response, the voltage level of the sense node 340 will decrease suchas depicted in dashed line tc. At time t3, after the sense node 340 hasbeen isolated from the data line 204, the sense node 340 is deboosted bysome particular voltage level, such as by removing a deboost voltage 553(e.g., deboost voltage level) from the voltage node 354, therebyreaching a deboosted voltage level at time t3a. At time t4, thetransistor 350 is connected to the voltage node 360 by biasing thecontrol signal senb to a voltage level sufficient to activate thetransistor 358. If the transistor 350 is activated, the voltage node 360is connected to the latch 364, thereby changing the logic level of theoutput signal sa_out, and if the transistor 350 is deactivated, thevoltage node 360 remains isolated form the latch 364, allowing the logiclevel of the output signal sa_out to remain unchanged. While thisexample describes a change in logic level of the output signal sa_out(e.g., a change in the logic level of the latch 364) from a logic highlevel to a logic low level as indicating the voltage level of the sensenode 340 being below the trip point of the transistor 350, a transitionfrom a logic low level to a logic high level could alternatively beprovided with appropriate changes in the latch 364, e.g., by providingan additional inverter to the output of the latch.

FIG. 5C is a timing diagram generally depicting a voltage level ofvarious nodes of a sense circuit such as depicted in FIG. 3 at variousstages of a sense operation, providing additional detail to anothersense operation such as described with reference to FIG. 4C, except thatisolation of the sense node might occur in response to cut-off of thetransistor 368 during a precharge portion. With regard to FIG. 5C, aprecharge portion of the sense operation may begin at time t0 by biasingcontrol signals blpre, blclamp and tc_iso to voltage levels sufficientto activate transistors 344, 368 and 352, respectively, therebyconnecting the data line 204 and the sense node 340 to the voltage node346. In response the voltage level tc of the sense node 340 and thevoltage level data line of the data line 204 increase. A voltage levelof the control signal blclamp might be chosen to provide a current levelof the transistor 368 similar to that of the NAND string 206. In thismanner, if the memory cell selected for sensing is activated, thevoltage level of the data line might remain near the reference voltage,as shown in dashed line. Conversely, if the memory cell selected forsensing is deactivated, the voltage level of the data line might rise toa level near blclamp minus the threshold voltage of the transistor 368as shown in solid line, such that V_(GS) of the transistor 368 may beinsufficient to maintain activation (e.g., cut-off). The boost voltage551 (e.g., boost voltage level) may be applied at voltage node 354during this time, reaching a level 551 at time t0a. At time t1, thesense node 340 may be isolated from the voltage node 346, such as bybiasing control signal blpre to a voltage level sufficient to deactivatethe transistor 344, and thus be allowed to seek to equilibrate with thedata line.

With the sense node 340 isolated from the voltage node 346, the voltagelevel of the sense node 340 may decrease, such as depicted in dashedline tc, if the selected memory cell is activated, and may tend toremain at the precharge level, such as depicted in solid line tc, if theselected memory cell is deactivated. At time t3, after the sense node340 has been isolated from the data line 204, the sense node 340 isdeboosted by some particular voltage level, such as by removing adeboost voltage 553 (e.g., deboost voltage level) from the voltage node354, thereby reaching a deboosted voltage level at time t3a. At time t4,the transistor 350 is connected to the voltage node 360 by biasing thecontrol signal senb to a voltage level sufficient to activate thetransistor 358. If the transistor 350 is activated, the voltage node 360is connected to the latch 364, thereby changing the logic level of theoutput signal sa_out, and if the transistor 350 is deactivated, thevoltage node 360 remains isolated form the latch 364, allowing the logiclevel of the output signal sa_out to remain unchanged. While thisexample describes a change in logic level of the output signal sa_out(e.g., a change in the logic level of the latch 364) from a logic highlevel to a logic low level as indicating the voltage level of the sensenode 340 being below the trip point of the transistor 350, a transitionfrom a logic low level to a logic high level could alternatively beprovided with appropriate changes in the latch 364, e.g., by providingan additional inverter to the output of the latch.

To compensate for temperature variations, changes in the precharge pathcan be incorporated into the sense circuit, e.g., to provide currentflow through the sense transistor 350. FIGS. 6A and 6B are schematics ofportions of a sense circuit in accordance with such embodiments. In FIG.6A, the sense enable transistor (e.g., pFET) 358 has a firstsource/drain connected to the voltage node 360 and a control gateconnected to receive the control signal senb on signal line 356. Thesense transistor (e.g., pFET) 350 has a first source/drain connected toa second source/drain of the transistor 358, a second source/drainconnected to an input of an optional latch 364, and a control gateconnected to the sense node 340. The precharge transistor 344 has afirst source/drain connected to the sense node 340, a secondsource/drain connected to the second source/drain of the transistor 350(and to the input of the latch 364), and a control gate connected toreceive the control signal blpre on signal line 342. In thisconfiguration, during the precharge portion of the sense operation, thesense node 340 can be precharged to a voltage level sufficient todeactivate the transistor 350. For example, current may flow from thevoltage node 360 through the transistor 344 (and through the transistors350 and 358) to the sense node 340 until a voltage level of the sensenode 340 reaches a level sufficient to deactivate the transistor 350.During this period, the control signal senb would have a voltage levelsufficient to activate the transistor 358. Such a configurationfacilitates precharging the sense node 340 (and the data line 204) to avoltage level near (e.g., at) the trip point of the transistor 350,regardless of the operating temperature.

In FIG. 6B, the sense transistor (e.g., pFET) 350 has a firstsource/drain connected to the voltage node 360 and a control gateconnected to the sense node 340. The sense enable transistor (e.g.,pFET) 358 has a first source/drain connected to a second source/drain ofthe transistor 350, a second source/drain connected to an input of anoptional latch 364, and a control gate connected to receive the controlsignal senb on signal line 356. The precharge transistor 344 has a firstsource/drain connected to the sense node 340, a second source/drainconnected to the second source/drain of the transistor 350 (and to thefirst source/drain of the transistor 358), and a control gate connectedto receive the control signal blpre on signal line 342. In thisconfiguration, during the precharge portion of the sense operation, thesense node 340 can be precharged to a voltage level sufficient todeactivate the transistor 350. For example, current may flow from thevoltage node 360 through the transistor 344 (and through the transistor350) to the sense node 340 until a voltage level of the sense node 340reaches a level sufficient to deactivate the transistor 350. During thisperiod, the control signal senb may have a voltage level sufficient todeactivate the transistor 358. Such a configuration facilitatesprecharging the sense node 340 (and the data line 204) to a voltagelevel near (e.g., at) the trip point of the transistor 350, regardlessof the operating temperature.

In addition to, or as an alternative to, configuring the precharge pathto include the sense transistor as described with reference to FIGS. 6Aand 6B, changes in the operation of the memory can also facilitatecompensation for temperature variations. For example, to compensate fora higher than nominal trip point, e.g., due to a higher than nominaloperating temperature, the sense node develop time, e.g., the timeperiod from time t2 to time t3 of FIGS. 4A, 4B and 5A, or the timeperiod from time t1 to time t2 of FIGS. 4C, 5B and 5C, can be shortenedfrom some nominal value. Similarly, to compensate for a lower thannominal trip point, e.g., due to a lower than nominal operatingtemperature, the sense node develop time can be lengthened from thenominal value. In general, the sense node develop time can be determinedas a function (e.g., a decreasing function) of the sensed temperature(e.g., of the indication of the sensed temperature).

To compensate for a higher than nominal trip point, e.g., due to ahigher than nominal operating temperature, the ratio of the deboostvoltage 553 (e.g., the voltage level removed from the boosted voltage)to the boost voltage 551 (e.g., the voltage level coupled to the sensenode from voltage node 354 prior to the sense node develop time), can bereduced from some nominal value. For example, where some voltage levelis applied to the voltage node 354 during a boost portion of a senseoperation (e.g., time period from time t1a to time t3a of FIGS. 4B and5), some value less than that voltage level may be removed from thevoltage node 354 (e.g., at time t3a). As an example, where a voltagelevel of the voltage node 354 is increased from a first voltage level(e.g., at time t1a of FIG. 5A or at time t0 of FIGS. 5B and 5C) to asecond voltage level (e.g., at time t1b of FIG. 5A or at time t0a ofFIGS. 5B and 5C), the voltage node 354 may be decreased to a thirdvoltage level (e.g., at time t4a of FIG. 5A or at time t3a of FIGS. 5Band 5C) that is less than the second voltage level, and may be greaterthan the first voltage level. The difference between the second voltagelevel and the first voltage level (e.g., an absolute value of thedifference) can be thought of as the boost voltage 551, and thedifference between the second voltage level and the third voltage level(e.g., an absolute value of the difference) can be thought of as thedeboost voltage 553. Similarly, to compensate for a lower than nominaltrip point, e.g., due to a lower than nominal operating temperature, theratio of the deboost voltage to the boost voltage can be increased fromthe nominal value. As an example, where a voltage level of the voltagenode 354 is increased from a first voltage level (e.g., at time t1a ofFIG. 5A or at time t0 of FIGS. 5B and 5C) to a second voltage level(e.g., at time t1b of FIG. 5A or time t0a of FIGS. 5B and 5C), thevoltage node 354 may be decreased to a third voltage level (e.g., attime t4a of FIG. 5A or at time t3a of FIGS. 5B and 5C) that is less thanthe second voltage level, and may be less than the first voltage level.In general, the ratio of the deboost voltage to the boost voltage can bedetermined as a function (e.g., a decreasing function) of the sensedtemperature. It is noted that using a fixed boost voltage and varyingthe deboost voltage can produce similar (e.g., the same) results asusing a fixed deboost voltage and varying the boost voltage. Similarly,both the boost voltage and the deboost voltage might be varied toproduce similar (e.g., the same) results.

To compensate for a higher than nominal trip point, e.g., due to ahigher than nominal operating temperature, the precharge voltage level(e.g., the voltage level developed at the sense node 340 during theprecharge portion) can be reduced from some nominal value. As anexample, the voltage level of the control signal blpre can be reduced,thereby causing the transistor 344 to cut off (e.g., become deactivated)at a lower voltage level on sense node 340 as the gate to source voltageof the transistor 344 will reach its threshold voltage at a lowerprecharge voltage level, or the voltage level applied to the voltagenode 346 may be reduced. Similarly, to compensate for a lower thannominal trip point, e.g., due to a lower than nominal operatingtemperature, the precharge voltage level can be increased from thenominal value. In general, the precharge voltage level (or the voltagelevel of the control signal blpre) can be determined as a function(e.g., a decreasing function) of the sensed temperature.

FIG. 7 is a flowchart of a portion of a method of operating a memoryaccording to an embodiment. At 780, a temperature is sensed to generatean indication of the sensed temperature. The indication is generallyrepresentative of the temperature being sensed and may be, for example,a voltage level indicative of the sensed temperature, a resistance levelindicative of the sensed temperature, a digital value indicative of thesensed temperature, etc. The temperature may be sensed by a temperaturesensor internal to the memory device containing the sense circuit.Alternatively, the temperature may be sensed by a temperature sensorexternal to the memory device. If an external temperature sensor isutilized, it may be beneficial to position the temperature sensor nearthe memory device such that the sensed ambient temperature might beexpected to be representative of the operating temperature of the memorydevice, and of the sense circuit. For example, the external temperaturesensor may be a component of a circuit board containing the memorydevice, a circuit module containing the memory device, a solid statedrive (SSD) containing the memory device, etc.

At 782, a decision might be made whether any temperature compensation isdesired. If compensation is not desired, the method may end at 784. Forexample, a memory device might be rated for operation from 0° C. to 70°C., which might be used as the relevant range of temperatures. It may bedetermined that the sense operation performs adequately withouttemperature compensation from 15° C. to 35° C., but that compensation isdesired at temperatures below 15° C. or above 35° C. If the sensedtemperature indicates a temperature at or between 15° C. and 35° C., nocompensation is desired and the method proceeds to 784. However, if thetemperature is below 15° C. or above 35° C., the method might proceedfor these subsets of the relevant range of temperatures. For someembodiments, the decision at 782 may be eliminated, thereby proceedingwith compensation for any temperature within a relevant range oftemperatures. For further embodiments, compensation may proceed for anysensed temperature.

At 786, the attribute of the sense node develop time is varied inresponse to the indication of the sensed temperature as a decreasingfunction of temperature. At 788, the attribute of the deboost voltage toboost voltage ratio is varied in response to the indication of thesensed temperature as a decreasing function of temperature. At 790, theattribute of the precharge voltage level is varied in response to theindication of the sensed temperature as a decreasing function oftemperature. Although all three of these compensation schemes aredepicted in FIG. 7, they may be used individually or in any combination.

Various embodiments have described varying a time (e.g., sense nodedevelop time), a ratio (e.g., ratio of deboost voltage level to boostvoltage level) or a voltage (e.g., precharge voltage level or controlsignal voltage level) as a function of temperature (e.g., ambienttemperature or device operating temperature). In general theseattributes may vary as a decreasing function of temperature. For variousdecreasing functions of temperature, a value of the attribute for someparticular temperature is less than or equal to the value of theattribute at each lesser relevant temperature, and may be less than thevalue of the attribute for at least a subset of lesser relevanttemperatures. The value of the attribute for the particular temperaturemay further be greater than or equal to the value of the attribute ateach greater relevant temperature, and may be greater than the value ofthe attribute for at least a subset of greater relevant temperatures.For some embodiments, each value of the attribute for any relevanttemperature is less than or equal to the value of the attribute at eachlesser relevant temperature, and less than the value of the attributefor at least a subset of lesser relevant temperatures.

As used herein, the range of relevant temperatures is an expected ordefined range of temperatures for operation of the device. For example,the decreasing functions may be defined within a range of temperaturesthe device is expected to experience during operation, a range oftemperatures for which the device is rated to operate (e.g., as definedby a manufacturer of the device), or a range of temperatures for whichtemperature compensation is desired, which may include any sensedtemperature. For some embodiments, temperature compensation outside ofthe range of relevant temperatures may be performed using a value of anattribute at one end of the range of relevant temperatures or the other,depending upon whether the sensed temperature is indicated to be belowor above the range of relevant temperatures. For example, where a sensenode develop time varies from a first value at a minimum temperature ofthe range of relevant temperatures to a second, lower, value at amaximum temperature of the range of relevant temperatures, the firstvalue of the sense node develop time might be used for any temperaturebelow the minimum temperature of the range of relevant temperatures andthe second value of the sense node develop time might be used for anytemperature above the maximum temperature of the range of relevanttemperatures. For other embodiments, the decreasing function may definean attribute value for any sensed temperature.

Examples of some types of decreasing functions of temperature aregenerally depicted in FIG. 8. Line 872 represents a linear decreasingfunction, e.g., having a constant negative slope. Line 874 represents adecreasing function of decreasing slope. For example, the function ofline 874 may have a slope near zero at the lower range of temperature,and the slope of line 874 may decrease (e.g., become more negative) asthe temperature is increased. Line 876 represents a decreasing functionof increasing slope. For example, the function of line 876 may have anegative slope at the lower range of temperature, and the slope of line876 may increase (e.g., become less negative) as the temperature isincreased. Line 878 represents a stepped decreasing function havingsuccessively lower steps as the temperature is increased. Note thatwhile steps of line 878 are depicted to have equal height 877 and equallength 879, these values could be varied. For example, a particular stepmay have a greater height 877 and lesser length 879 than a precedingstep, or it may have a lesser height 877 and greater length 879 than apreceding step. Stepped functions may represent the use of a look-uptable, where the value of the attribute is determined by looking up thevalue of the temperature in the table and selecting the value of theattribute corresponding to that temperature. Table 1 is a conceptualexample of a look-up table. Alternatively, the value of the attributefor a decreasing function may be directly calculated from an equation ofthe decreasing function, e.g., Y=ƒ(T).

TABLE 1 Attribute Values (Y) as Function of Sensed Temperature (T)Sensed Temperature (T) Attribute Value (Y) T1 <= T < T2 Y1 T2 <= T < T3Y2 T3 <= T < T4 Y3 T4 <= T <= T5 Y4

While several examples of decreasing functions are described withreference to FIG. 8, other decreasing functions can be used where avalue of the attribute at some relevant temperature is less than orequal to the value of the attribute at each lesser relevant temperature,and less than the value of the attribute for at least a subset of lesserrelevant temperatures. Decreasing functions described herein might, forexample, be determined experimentally, empirically or throughsimulation.

Note that the decreasing functions may define attribute values for whichthe memory device is not configured to attain. This may be the result ofphysical constraints, e.g., a negative develop time or a voltage levelthat is harmful to the memory device. For such constraints, the memorydevice (e.g., controller of the memory device) might be configured tolimit variations of attributes of the sense operation to values to arange within its ability to attain and/or to a range within the abilityof the attribute to produce the desired response, e.g., to provide anexpected benefit to the sense operation.

Constraints may further include configuration constraints, e.g., thememory device (e.g., controller of the memory device) might beconfigured to generate some limited number of different values for theattribute. For example, process variation among integrated circuitdevices is to be expected, and memory device manufacturers often providean ability at the time of fabrication to select values of suchattributes as read voltages, program voltages, erase voltages, etc. toprovide the expected performance of the memory device despite thisprocess variation. This is often enabled by the use of trim registers,where different values of a trim register correspond to different valuesof an attribute. After testing of the memory device, these trimregisters are set to select the desired attribute value for operation ofthe memory device. Typically, these trim registers contain one or moredigits of storage (e.g., fuses, anti-fuses, memory cells, etc.), andeach digital value of a trim register corresponds to a particularrespective attribute value. A one-digit trim register can represent oneof two attribute values, a two-digit trim register can represent one ofup to four attribute values, a three-digit trim register can representone of up to eight attribute values, etc.

Where a reprogrammable trim register (e.g., using memory cells) is used,the controller (e.g., the internal controller) of the memory devicecould set a register value to vary an attribute value for individualsense operations responsive to the sensed temperature. Table 2 extendsthe example of Table 1 to show how trim registers might be used toselect attribute values for the sense operation as a function of thesensed temperature using a two-digit trim register, while Table 3extends the example of Table 1 to show how trim registers might be usedto select attribute values for the sense operation as a function of thecalculated attribute value using a two-digit trim register. Note thatwhile Table 3 depicts the selected attribute value as a function of thecalculated attribute value, it remains a function of the sensedtemperature as the calculated attribute value is a function of thesensed temperature.

TABLE 2 Register Values and Attribute Values (Y) as Function of SensedTemperature (T) Sensed Temperature (T) Register Value Attribute Value(Y) T1 <= T < T2 00 Y1 T2 <= T < T3 01 Y2 T3 <= T < T4 10 Y3 T4 <= T <=T5 11 Y4

TABLE 3 Register Values and Attribute Values (Y) as Function ofCalculated Attribute Value (Y′) Calculated Attribute Value (Y′) RegisterValue Attribute Value (Y) Y′1 <= Y′ < Y′2 00 Y1 Y′2 <= Y′ < Y′3 01 Y2Y′3 <= Y′ < Y′4 10 Y3 Y′4 <= Y′ <= Y′5 11 Y4

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments.

What is claimed is:
 1. An apparatus, comprising: an array of memorycells; a data line selectively connected to a memory cell of the arrayof memory cells; and a sense circuit, comprising: a sense nodeselectively connected to the data line; a precharge transistor connectedbetween the sense node and a voltage node and having a control gateconfigured to receive a first control signal, a first source/drainconnected to the sense node, and a second source/drain; a sensetransistor connected between the voltage node and the secondsource/drain of the precharge transistor and having a control gateconnected to the sense node, a first source/drain connected to thesecond source/drain of the precharge transistor, and a secondsource/drain; and a sense enable transistor connected between thevoltage node and the second source/drain of the sense transistor andhaving a control gate configured to receive a second control signal, afirst source/drain connected to the second source/drain of the sensetransistor, and a second source/drain connected to the voltage node. 2.The apparatus of claim 1, further comprising: a controller configured toperform a sense operation on a selected memory cell of the array ofmemory cells using the sense circuit, wherein the controller is furtherconfigured to selectively vary at least one attribute of the senseoperation in response to an indication of a sensed temperature, the atleast one attribute selected from a group consisting of a sense nodedevelop time during the sense operation, a ratio of a deboost voltagelevel capacitively decoupled from the sense node to a boost voltagelevel capacitively coupled to the sense node during the sense operation,and a precharge voltage level of the sense node during the senseoperation.
 3. The apparatus of claim 2, further comprising: atemperature sensor in communication with the controller for use ingenerating the indication of the sensed temperature.
 4. The apparatus ofclaim 3, wherein the temperature sensor is internal to the apparatus. 5.The apparatus of claim 2, wherein the controller is further configuredto vary the at least one attribute of the sense operation when theindication of the sensed temperature indicates a temperature in aparticular range of temperatures.
 6. The apparatus of claim 5, whereinthe controller is further configured to vary the at least one attributeof the sense operation only when the indication of the sensedtemperature indicates a temperature in one or more subsets oftemperatures of the particular range of temperatures.
 7. The apparatusof claim 2, wherein the controller is further configured to selectivelyvary the ratio of the deboost voltage level to the boost voltage levelby fixing a value of one of the boost voltage level and the deboostvoltage level, and varying the value of the other one of the boostvoltage level and the deboost voltage level.
 8. An apparatus,comprising: an array of memory cells; a data line selectively connectedto a memory cell of the array of memory cells; and a sense circuit,comprising: a sense node selectively connected to the data line; aprecharge transistor connected between the sense node and a voltage nodeand having a control gate configured to receive a first control signal,a first source/drain connected to the sense node, and a secondsource/drain; a sense transistor connected between the voltage node andthe second source/drain of the precharge transistor and having a controlgate connected to the sense node, a first source/drain connected to thesecond source/drain of the precharge transistor, and a secondsource/drain connected to the voltage node; and a sense enabletransistor connected between the second source/drain of the prechargetransistor and an output of the sense circuit and having a control gateconfigured to receive a second control signal, a first source/drainconnected to the second source/drain of the precharge transistor, and asecond source/drain.
 9. The apparatus of claim 8, further comprising: acontroller configured to perform a sense operation on a selected memorycell of the array of memory cells using the sense circuit, wherein thecontroller is further configured to selectively vary at least oneattribute of the sense operation in response to an indication of asensed temperature, the at least one attribute selected from a groupconsisting of a sense node develop time during the sense operation, aratio of a deboost voltage level capacitively decoupled from the sensenode to a boost voltage level capacitively coupled to the sense nodeduring the sense operation, and a precharge voltage level of the sensenode during the sense operation.
 10. The apparatus of claim 9, furthercomprising: a temperature sensor in communication with the controllerfor use in generating the indication of the sensed temperature.
 11. Theapparatus of claim 10, wherein the temperature sensor is internal to theapparatus.
 12. The apparatus of claim 9, wherein the controller isfurther configured to vary the at least one attribute of the senseoperation when the indication of the sensed temperature indicates atemperature in a particular range of temperatures.
 13. The apparatus ofclaim 12, wherein the controller is further configured to vary the atleast one attribute of the sense operation only when the indication ofthe sensed temperature indicates a temperature in one or more subsets oftemperatures of the particular range of temperatures.
 14. The apparatusof claim 9, wherein the controller is further configured to selectivelyvary the ratio of the deboost voltage level to the boost voltage levelby fixing a value of one of the boost voltage level and the deboostvoltage level, and varying the value of the other one of the boostvoltage level and the deboost voltage level.
 15. The apparatus of claim8, further comprising a latch connected between the output of the sensecircuit and the second source/drain of the sense enable transistor. 16.A method of operating a memory, comprising: generating an indication ofa sensed temperature; and selectively varying a value of a prechargevoltage level of a sense node during a sense operation of the memory;wherein varying the value of the precharge voltage level comprisesvarying a voltage level of a control signal applied to a control gate ofa transistor, connected between and in series with the sense node and avoltage node, in response to the indication of the sensed temperature.17. The method of claim 16, further comprising: selectively varying arespective value of at least one attribute of the sense operation of thememory in response to the indication of the sensed temperature, the atleast one attribute selected from a group consisting of a sense nodedevelop time during the sense operation, and a ratio of a deboostvoltage level capacitively decoupled from the sense node to a boostvoltage level capacitively coupled to the sense node during the senseoperation.
 18. The method of claim 16, wherein varying the voltage levelof the control signal comprises varying the voltage level of the controlsignal as a decreasing function of the sensed temperature.
 19. Themethod of claim 16, wherein varying the voltage level of the controlsignal applied to the control gate of the transistor comprises applyinga first voltage level to the control gate of the transistor when theindication of the sensed temperature indicates any temperature in afirst range of temperatures, and applying a second voltage level, lowerthan the first voltage level, to the control gate of the transistor whenthe indication of the sensed temperature indicates any temperature in asecond range of temperatures higher than the first range oftemperatures.
 20. The method of claim 16, wherein selectively varyingthe value of the precharge voltage level of the sense node comprisesvarying the value of the precharge voltage level of the sense node onlywhen a temperature corresponding to the indication of the sensedtemperature is lower than or higher than a particular range oftemperatures.